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IEEE
IEEE Transactions on Advanced Packaging Template
Write in a clean editor, then format for IEEE Transactions on Advanced Packaging in one click — DocuGuru applies the official IEEE template with numbered references and exports a submission-ready PDF plus the editable LaTeX source. Free to start.
About the IEEE Transactions on Advanced Packaging format
IEEE Transactions on Advanced Packaging is a peer-reviewed journal published by IEEE, covering Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Electromagnetic Compatibility and Noise Suppression.
| Publisher | IEEE |
|---|---|
| Reference style | Numbered (IEEE) Numbered — [1], [2] in the text [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Advanced Packaging, vol. 12, no. 3, pp. 45–58, 2023.
Formats any DOI in IEEE Transactions on Advanced Packaging style. No sign-up. |
| Publishes research in | Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Electromagnetic Compatibility and Noise Suppression Semiconductor Lasers and Optical Devices Microwave Engineering and Waveguides |
| ISSN | 1521-3323 |
| h-index | 83 |
| i10-index | 727 |
| Total citations | 31,657 |
| Top institutions publishing here | Georgia Institute of Technology |
| Journal website | ieeexplore.ieee.org |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Papers published in IEEE Transactions on Advanced Packaging per year
Citation impact of IEEE Transactions on Advanced Packaging by publication year
Citations each year’s papers have accumulated so far — the most recent years are still building up.
Most-cited papers in IEEE Transactions on Advanced Packaging
Power systems for modern complementary metal-oxide-semiconductor (CMOS) technology are becoming harder to design. One design methodology is to identify a target impedance to be met across a broad frequency range and specify components to meet that impedance. The impedance versus frequency profiles of the power distribution system components including the voltage regulator module, bulk decoupling…
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In this paper, we present four purely textile patch antennas for Bluetooth applications in wearable computing using the frequency range around 2.4 GHz. The textile materials and the planar antenna shape provide a smooth integration into clothing while preserving the typical properties of textiles. The four antennas differ in the deployed materials and in the…
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<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> Modern packaging design requires extensive signal integrity simulations in order to assess the electrical performance of the system. The feasibility of such simulations is granted only when accurate and efficient models are available for all system parts and components having a significant influence on the signals. Unfortunately, model derivation is still a…
302 citations
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Most TSVs are filled with copper; siliconpoly and tungsten are the alternatives. The coefficient of thermal expansion (CTE) of copper (~17.5 times 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-6</sup> /degC) is a few times higher than that of silicon (~2.5 times10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-6</sup> /degC). Thus, when the copper filled through silicon via (TSV) is subjected to temperature…
297 citations
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IEEE Transactions on Advanced Packaging template — frequently asked questions
How do I write a paper in the IEEE Transactions on Advanced Packaging format?
In DocuGuru you write your manuscript in a normal editor — no LaTeX setup required — and select the IEEE Transactions on Advanced Packaging template. When you export, DocuGuru compiles the paper into the official IEEE format and hands you a submission-ready PDF along with the editable LaTeX source.
What reference style does IEEE Transactions on Advanced Packaging use?
IEEE Transactions on Advanced Packaging uses Numbered (IEEE) references, shown as numbered [1], [2] markers in the text. DocuGuru formats every in-text citation and the reference list in this exact style automatically. A reference appears like this: [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Advanced Packaging, vol. 12, no. 3, pp. 45–58, 2023.
Do I need to know LaTeX to submit to IEEE Transactions on Advanced Packaging?
No. DocuGuru generates the IEEEtran LaTeX class and compiles the PDF for you in the background, so you get a IEEE-ready IEEE Transactions on Advanced Packaging document without writing any LaTeX. If you do want it, the LaTeX source is included in the export.
Can I import an existing draft into the IEEE Transactions on Advanced Packaging template?
Yes. Paste or upload your current manuscript — Word, LaTeX, Markdown, or plain text — and DocuGuru reflows it into the IEEE Transactions on Advanced Packaging format with correct headings, figures, tables, and numbered citations.
Who publishes IEEE Transactions on Advanced Packaging?
IEEE Transactions on Advanced Packaging is a engineering and computer science journal published by IEEE. DocuGuru's IEEE Transactions on Advanced Packaging template matches IEEE's official submission format.
Can I export a submission-ready IEEE Transactions on Advanced Packaging PDF?
Yes — DocuGuru produces a PDF built with the official IEEE Transactions on Advanced Packaging template (the IEEEtran class) that is ready to submit to IEEE, together with the matching LaTeX source files.
How much does the IEEE Transactions on Advanced Packaging template cost?
You can start writing in the IEEE Transactions on Advanced Packaging template for free. Exporting the final submission-ready IEEE Transactions on Advanced Packaging PDF and LaTeX source is part of DocuGuru's paid plans — see the app for current pricing.