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IEEE Transactions on Parts Hybrids and Packaging is a peer-reviewed journal published by IEEE, covering Electronic Packaging and Soldering Technologies, Electrical Contact Performance and Analysis, Semiconductor materials and devices.
| Publisher | IEEE |
|---|---|
| Reference style | Numbered (IEEE) Numbered — [1], [2] in the text [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Parts Hybrids and Packaging, vol. 12, no. 3, pp. 45–58, 2023.
Formats any DOI in IEEE Transactions on Parts Hybrids and Packaging style. No sign-up. |
| Publishes research in | Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis Semiconductor materials and devices 3D IC and TSV technologies Copper Interconnects and Reliability |
| ISSN | 0361-1000 |
| h-index | 29 |
| i10-index | 97 |
| Total citations | 4,443 |
| Top institutions publishing here | Sandia National Laboratories California |
| Journal website | ieeexplore.ieee.org |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
Negative mutual inductance results from coupling between two conductors having current vectors in opposite directions. As a quantity in electronic circuits, negative mutual inductance is usually so much smaller in magnitude than overall inductance that it can be neglected with little effect. In the microelectronic world, however, its neglect can result in inductance values as…
This paper represents a review as well as an extension of previous work concerned with the mechanism of microelectronic ultrasonic welding for both aluminum and gold wires. A series of experiments was carried out to determine the mechanism of gold-to-gold ultrasonic bonding. These experiments, including lift-off pattern studies, clamped-wire studies, and bond deformation versus ultrasonic…
The ultraviolet (UV)/ozone cleaning procedure is shown to be an effective method of rapidly removing a variety of contaminants from surfaces. It is a simple-to-use dry process which is inexpensive to set up and operate. It can produce · clean surfaces in air, at ambient temperatures. The experiments were performed on quartz and metal surfaces.…
Organic adhesives are useful lid sealants because they are processed at low temperatures, are inexpensive, and are easy to rework. However, there has been concern about the degree of protection organics can provide moisture-sensitive components. Data presented in this paper show that organic adhesives can seal packages which pass gross and fine leak tests but…
ZnO varistors are novel ceramic semiconductor devices used for protection of electronic equipment against transient overvoltages due to switching surges or lightning. This article describes the microstructure, circuit behavior, and operation of ZnO varistors. ZnO varistors have highly nonlinear current-voltage characteristics similar to back-to-back Zener diodes but with much greater current, voltage, and energy handling…
