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IEEE Transactions on Components, Packaging and Manufacturing Technology is a peer-reviewed journal published by IEEE, covering Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Microwave Engineering and Waveguides. Over its lifetime it has published 5,169 papers, which have received 61,003 citations.
| Publisher | IEEE |
|---|---|
| Reference style | Numbered (IEEE) Numbered — [1], [2] in the text [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 3, pp. 45–58, 2023.
Formats any DOI in IEEE Transactions on Components, Packaging and Manufacturing Technology style. No sign-up. |
| Abbreviation (ISO-4) | TCPMT |
| Publishes research in | Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Microwave Engineering and Waveguides Electromagnetic Compatibility and Noise Suppression Advanced Antenna and Metasurface Technologies |
| ISSN | 2156-3950 |
| Citation impact (2-yr) | 2.35 |
| h-index | 78 |
| i10-index | 1,854 |
| Top institutions publishing here | Georgia Institute of Technology |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
In this study, advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance, and are grouped into 2-D, 2.1-D, 2.3-D, 2.5-D, and 3-D IC integration, which will be presented and discussed. Chiplet design and heterogeneous integration packaging provide alternatives to the system on chips (especially for…
We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RLGC</i> equations derived…
The need for high power density and high temperature capabilities in today's electronic devices continues to grow. More robust devices with reliable and stable functioning capabilities are needed, for example in aerospace and automotive industries as well as sensor technology. These devices need to perform under extreme temperature conditions, and not show any deterioration in…
This paper first reviews manufacturing technologies for realizing air-filled metal-pipe rectangular waveguides (MPRWGs) and 3-D printing for microwave and millimeter-wave applications. Then, 3-D printed MPRWGs are investigated in detail. Two very different 3-D printing technologies have been considered: low-cost lower-resolution fused deposition modeling for microwave applications and higher-cost high-resolution stereolithography for millimeter-wave applications. Measurements against…
Interconnecting integrated circuits (ICs) and 3-D-ICs to the system board (printed circuit board) are currently achieved using organic or silicon-based interposers. Organic interposers face several challenges in packaging 2-D and 3-D-ICs beyond the 32-nm node, primarily due to their poor dimensional stability and coefficient of thermal expansion (CTE) mismatch to silicon. Silicon interposers made with…
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