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IEEE Transactions on Components and Packaging Technologies is a peer-reviewed journal published by IEEE, covering Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Heat Transfer and Optimization.
| Publisher | IEEE |
|---|---|
| Reference style | Numbered (IEEE) Numbered — [1], [2] in the text [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Components and Packaging Technologies, vol. 12, no. 3, pp. 45–58, 2023.
Formats any DOI in IEEE Transactions on Components and Packaging Technologies style. No sign-up. |
| Publishes research in | Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Heat Transfer and Optimization Electrical Contact Performance and Analysis Adhesion, Friction, and Surface Interactions |
| ISSN | 1521-3331 |
| h-index | 88 |
| i10-index | 859 |
| Total citations | 41,540 |
| Top institutions publishing here | University of Maryland, College Park |
| Journal website | ieeexplore.ieee.org |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored…
Presents here a complete dynamic model of a lithium ion battery that is suitable for virtual-prototyping of portable battery-powered systems. The model accounts for nonlinear equilibrium potentials, rate- and temperature-dependencies, thermal effects and response to transient power demand. The model is based on publicly available data such as the manufacturers' data sheets. The Sony US18650…
The performance of a battery-ultracapacitor hybrid power source under pulsed load conditions is analytically described using simplified models. We show that peak power can be greatly enhanced, internal losses can be considerably reduced, and that discharge life of the battery is extended. Greatest benefits are seen when the load pulse rate is higher than the…
Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux…
There has been a growing interest in monitoring the ongoing "health" of products and systems in order to predict failures and provide warning to avoid catastrophic failure. Here, health is defined as the extent of degradation or deviation from an expected normal condition. While the application of health monitoring, also referred to as prognostics, is…
