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Microelectronics is a peer-reviewed journal published by MDPI, covering Advancements in Semiconductor Devices and Circuit Design, Radio Frequency Integrated Circuit Design, VLSI and Analog Circuit Testing. Over its lifetime it has published 165 papers, which have received 145 citations.
| Publisher | MDPI |
|---|---|
| Reference style | Numbered (MDPI) Numbered — [1], [2] in the text 1. Smith, A.; Jones, B.; Lee, C. A Representative Article Title. Microelectronics 2023, 12, 45–58.
Formats any DOI in Microelectronics style. No sign-up. |
| Publishes research in | Advancements in Semiconductor Devices and Circuit Design Radio Frequency Integrated Circuit Design VLSI and Analog Circuit Testing Integrated Circuits and Semiconductor Failure Analysis Sensor Technology and Measurement Systems |
| ISSN | 3042-5344 |
| Citation impact (2-yr) | 0.45 |
| h-index | 5 |
| i10-index | 2 |
| Open access | Yes |
| Top institutions publishing here | Systems Engineering Research Center |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
Automatic techniques for analog integrated circuit layout design have been proposed in the literature for over four decades. However, as analog design moves into deep nanometer integration nodes, the increasing number of design rules, the influence of layout-dependent effects, congestion, and the impact of parasitic structures constantly challenges existing automatic layout generation techniques and keeps…
Quantum biosensors offer a promising route to overcome the sensitivity and specificity limitations of conventional biosensing technologies. Their ability to detect biochemical signals at extremely low concentrations makes them strong candidates for next-generation sensing systems. This paper reviews the current state of quantum biosensors and discusses their future implementation in chip-scale platforms that combine microelectronic…
Most Flip Chip assemblies require underfill to bestow reliability that would otherwise be ravished by stress due to thermomechanical mismatch between die and substrate. While underfill can be viewed as polymer magic and the key to modern Flip Chip success, many see it as the process bottleneck that must be eliminated in the future. Both…
A high-frequency and small-signal equivalent circuit of SiGe HBT is presented in this paper. By using microwave network theory, S and H21 parameters of the device are simulated. Results from simulation are in good agreement with those from test. Furthermore, effects of package-induced parasitic parameters on the high-frequency characteristics are analyzed based on the circuit…
Strained silicon is an important technique to extend Moore's Law.In this paper,technical progress and trends of strained silicon are reviewed.Physical mechanisms responsible for mobility enhancement in strained silicon are explained,and various state-of-the-art strained silicon techniques are examined.Finally,the technological trends of strained silicon are discussed.
