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IEEE Transactions on Signal and Power Integrity Template

Write in a clean editor, then format for IEEE Transactions on Signal and Power Integrity in one click — DocuGuru applies the official IEEE template with numbered references and exports a submission-ready PDF plus the editable LaTeX source. Free to start.

About the IEEE Transactions on Signal and Power Integrity format

IEEE Transactions on Signal and Power Integrity is a peer-reviewed journal published by IEEE, covering Electromagnetic Compatibility and Noise Suppression, Low-power high-performance VLSI design, 3D IC and TSV technologies. Over its lifetime it has published 112 papers, which have received 290 citations.

PublisherIEEE
Reference styleNumbered (IEEE)
Numbered — [1], [2] in the text
[1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Signal and Power Integrity, vol. 12, no. 3, pp. 45–58, 2023.

Formats any DOI in IEEE Transactions on Signal and Power Integrity style. No sign-up.

Abbreviation (ISO-4)TSPI
Publishes research inElectromagnetic Compatibility and Noise Suppression Low-power high-performance VLSI design 3D IC and TSV technologies Microwave Engineering and Waveguides Advanced Antenna and Metasurface Technologies
ISSN2768-1866
Citation impact (2-yr)1.19
h-index8
i10-index6
Top institutions publishing hereMissouri University of Science and Technology
You getA submission-ready PDF and the editable LaTeX source — ready to submit.

Papers published in IEEE Transactions on Signal and Power Integrity per year

22
2022
22
2023
22
2024
29
2025

Citation impact of IEEE Transactions on Signal and Power Integrity by publication year

111
2022
89
2023
51
2024
18
2025

Citations each year’s papers have accumulated so far — the most recent years are still building up.

Most-cited papers in IEEE Transactions on Signal and Power Integrity

Efficient DC and AC Impedance Calculation for Arbitrary-Shape and Multilayer PDN Using Boundary Integration

Ling Zhang, Jack Juang, Zurab Kiguradze et al. · 1 Jan 2022

This article presents an efficient methodology based on boundary integration to calculate the dc and ac impedance of power distribution networks (PDNs) for arbitrary-shape and multilayer printed circuit boards (PCBs). The proposed method adopts a boundary element method to extract inductances for the arbitrary parallel-plane shapes. Subsequently, the equivalent circuit formed by the via inductances…

Novel Target-Impedance Extraction Method-Based Optimal PDN Design for High-Performance SSD Using Deep Reinforcement Learning

Jinwook Song, D. Jung, Jaeyoung Shin et al. · 1 Jan 2023

In this article, we first propose and demonstrate a novel target-impedance (Z) extraction based optimal power distribution network (PDN) design methodology for high performance solid-state-drive (SSD) products. Instead of using the current profile of a chip power models (CPMs), the suggested methodology uses both measured current spectra and hierarchical PDN-Z models for target-Z calculation. We…

A Radial Basis Function Network-Based Surrogate-Assisted Swarm Intelligence Approach for Fast Optimization of Power Delivery Networks

Heman Vaghasiya, Akash Jain, Jai Narayan Tripathi · 1 Jan 2022

The design and optimization of Power Delivery Networks (PDNs) in Very Large Scale Integration (VLSI) systems is becoming very challenging with the increasing complexity of such systems. Decoupling capacitors are the key elements used in a PDN to minimize power supply noise and to maintain low impedance of the PDN to avoid system failure. In…

Long Short-Term Memory Neural Equalizer

Zihao Wang, Zhifei Xu, Jiayi He et al. · 1 Jan 2023

A trainable neural equalizer based on the long short-term memory (LSTM) neural network architecture is proposed in this article to recover the channel output signal. The current widely used solution for the transmission line signal recovery is generally realized through a decision feedback equalizer (DFE) or : Feed forward equalizer (FFE) combination. The novel learning-based…

Mode-Decomposition-Based Equivalent Model of High-Speed Vias up to 100 GHz

Chaofeng Li, Kevin Cai, Muqi Ouyang et al. · 1 Jan 2023

Via transitions in high-speed channels critically influence the signal integrity and power integrity of high-speed systems. In this work, a mode-decomposition-based equivalent model of a high-speed via that can be applied at frequencies up to 100 GHz is proposed for the first time. The equivalent model for modeling the via transition consists of upper and…

IEEE Transactions on Signal and Power Integrity template — frequently asked questions

How do I write a paper in the IEEE Transactions on Signal and Power Integrity format?
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What reference style does IEEE Transactions on Signal and Power Integrity use?
IEEE Transactions on Signal and Power Integrity uses Numbered (IEEE) references, shown as numbered [1], [2] markers in the text. DocuGuru formats every in-text citation and the reference list in this exact style automatically. A reference appears like this: [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Signal and Power Integrity, vol. 12, no. 3, pp. 45–58, 2023.
Do I need to know LaTeX to submit to IEEE Transactions on Signal and Power Integrity?
No. DocuGuru generates the IEEEtran LaTeX class and compiles the PDF for you in the background, so you get a IEEE-ready IEEE Transactions on Signal and Power Integrity document without writing any LaTeX. If you do want it, the LaTeX source is included in the export.
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Who publishes IEEE Transactions on Signal and Power Integrity?
IEEE Transactions on Signal and Power Integrity is a engineering and computer science journal published by IEEE. DocuGuru's IEEE Transactions on Signal and Power Integrity template matches IEEE's official submission format.
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