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IEEE Transactions on Components Packaging and Manufacturing Technology Part A is a peer-reviewed journal published by IEEE, covering Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Electrical Contact Performance and Analysis.
| Publisher | IEEE |
|---|---|
| Reference style | Numbered (IEEE) Numbered — [1], [2] in the text [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Components Packaging and Manufacturing Technology Part A, vol. 12, no. 3, pp. 45–58, 2023.
Formats any DOI in IEEE Transactions on Components Packaging and Manufacturing Technology Part A style. No sign-up. |
| Publishes research in | Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Electrical Contact Performance and Analysis Heat Transfer and Optimization Semiconductor materials and devices |
| ISSN | 1070-9886 |
| h-index | 57 |
| i10-index | 277 |
| Total citations | 12,080 |
| Top institutions publishing here | Motorola (United States) |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
An analytical simulation model has been developed for predicting and optimizing the thermal performance of bidirectional fin heat sinks in a partially confined configuration. Sample calculations are carried out, and parametric plots are provided, illustrating the effect of various design parameters on the performance of a heat sink. It is observed that the actual convection…
Modular products refer to products, assemblies, and components that fulfill various functions through the combination of distinct building blocks. As companies strive to rationalize engineering design, manufacturing, and support processes and to produce a large variety of products at lower costs, modularity is becoming a focus. However, modularity has been treated in the literature at…
Plastic electronic packages are known to absorb moisture when exposed to humid ambient conditions during storage in tape and reel in the factory. Reliability becomes a concern when packages are exposed to a humid environment for a prolonged time and then processed through a reflow oven. Thermo-mechanical and moisture induced interfacial stresses generated between the…
High-temperature electronics applications are found in combustion systems, well logging, and industrial processes, air stagnation points in supersonic aircraft, vehicle brakes, nuclear reactors, and dense electronic packages. We summarize physical effects and materials issues important for reliable operation of semiconductor device technologies at high temperatures (>125/spl deg/C). We review the high-temperature potential of Si, GaAs,…
Anisotropic conductive film (ACF) composed of an adhesive resin and fine conductive fillers such as metallic particles or metal-coated polymer balls are key materials for fine pitch chip-on-film (COF) and chip-on-glass (COG) LCD packaging technologies. To understand and design better quality ACF materials, the theoretical electrical conduction model with physical contact mechanism was simulated and…
