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Journal of Electronic Packaging Template

Write in a clean editor, then format for Journal of Electronic Packaging in one click — DocuGuru applies the official ASME template with numbered references and exports a submission-ready PDF plus the editable LaTeX source. Free to start.

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About the Journal of Electronic Packaging format

Journal of Electronic Packaging is a peer-reviewed journal published by ASME, covering Electronic Packaging and Soldering Technologies, Heat Transfer and Optimization, 3D IC and TSV technologies. Over its lifetime it has published 2,295 papers, which have received 45,316 citations.

PublisherASME
Reference styleNumbered (ASME)
Numbered — [1], [2] in the text
[1] Smith, A., Jones, B., and Lee, C., 2023, "A Representative Article Title," Journal of Electronic Packaging, 12(3), pp. 45–58.

Formats any DOI in Journal of Electronic Packaging style. No sign-up.

Publishes research inElectronic Packaging and Soldering Technologies Heat Transfer and Optimization 3D IC and TSV technologies Heat Transfer and Boiling Studies Heat Transfer Mechanisms
ISSN1043-7398
Citation impact (2-yr)1.8
h-index80
i10-index1,090
Top institutions publishing hereGeorgia Institute of Technology
Journal websitebooks.google.com
You getA submission-ready PDF and the editable LaTeX source — ready to submit.

Papers published in Journal of Electronic Packaging per year

80
2014
35
2015
57
2016
44
2017
47
2018
63
2019
87
2020
78
2021
54
2022
42
2023
50
2024
52
2025

Citation impact of Journal of Electronic Packaging by publication year

1.6K
2014
657
2015
1.9K
2016
589
2017
909
2018
1K
2019
1.1K
2020
1K
2021
363
2022
267
2023
200
2024
56
2025

Citations each year’s papers have accumulated so far — the most recent years are still building up.

Most-cited papers in Journal of Electronic Packaging

Buoyancy-Induced Flows and Transport

B. Gebhart, Yogesh Jaluria, Roop L. Mahajan et al. · 1 Dec 1989

Contents: Introduction.- General Formulation of Buoyancy-Induced Flows.- External Vertical Thermally Induced Flows.- Vertical Axisymmetric Flows.- Other Than Vertical Flows.- Combined Mass and Thermal Transport.- Unsteady External Flows.- Effects of Variable Fluid Properties.- Transport in Cold Pure and Saline Water.- Mixed Convection.- Instability, Transition and Turbulence.- Turbulent Free-Boundary Buoyant Flows.- Unstably Stratified Fluid Layers.- Transport in…

1,238 citations Cite SaveGo to paper →
Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Dongliang Zhao, Xin Qian, Xiaokun Gu et al. · 6 Sep 2016

Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state method, transient…

473 citations Cite SaveGo to paper →

Journal of Electronic Packaging template — frequently asked questions

How do I write a paper in the Journal of Electronic Packaging format?
In DocuGuru you write your manuscript in a normal editor — no LaTeX setup required — and select the Journal of Electronic Packaging template. When you export, DocuGuru compiles the paper into the official ASME format and hands you a submission-ready PDF along with the editable LaTeX source.
What reference style does Journal of Electronic Packaging use?
Journal of Electronic Packaging uses Numbered (ASME) references, shown as numbered [1], [2] markers in the text. DocuGuru formats every in-text citation and the reference list in this exact style automatically. A reference appears like this: [1] Smith, A., Jones, B., and Lee, C., 2023, "A Representative Article Title," Journal of Electronic Packaging, 12(3), pp. 45–58.
Do I need to know LaTeX to submit to Journal of Electronic Packaging?
No. DocuGuru generates the asmejour LaTeX class and compiles the PDF for you in the background, so you get a ASME-ready Journal of Electronic Packaging document without writing any LaTeX. If you do want it, the LaTeX source is included in the export.
Can I import an existing draft into the Journal of Electronic Packaging template?
Yes. Paste or upload your current manuscript — Word, LaTeX, Markdown, or plain text — and DocuGuru reflows it into the Journal of Electronic Packaging format with correct headings, figures, tables, and numbered citations.
What is Journal of Electronic Packaging?
ASME journal. It is a engineering and computer science journal, published by ASME.
Can I export a submission-ready Journal of Electronic Packaging PDF?
Yes — DocuGuru produces a PDF built with the official Journal of Electronic Packaging template (the asmejour class) that is ready to submit to ASME, together with the matching LaTeX source files.
How much does the Journal of Electronic Packaging template cost?
You can start writing in the Journal of Electronic Packaging template for free. Exporting the final submission-ready Journal of Electronic Packaging PDF and LaTeX source is part of DocuGuru's paid plans — see the app for current pricing.
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