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IEEE Transactions on Electronics Packaging Manufacturing is a peer-reviewed journal published by IEEE, covering Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Material Properties and Processing.
| Publisher | IEEE |
|---|---|
| Reference style | Numbered (IEEE) Numbered — [1], [2] in the text [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Electronics Packaging Manufacturing, vol. 12, no. 3, pp. 45–58, 2023.
Formats any DOI in IEEE Transactions on Electronics Packaging Manufacturing style. No sign-up. |
| Publishes research in | Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Material Properties and Processing Wireless Body Area Networks Bluetooth and Wireless Communication Technologies |
| ISSN | 1521-334X |
| h-index | 56 |
| i10-index | 308 |
| Total citations | 13,883 |
| Top institutions publishing here | Georgia Institute of Technology |
| Journal website | ieeexplore.ieee.org |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
The underhood automotive environment is harsh and current trends in the automotive electronics industry will be pushing the temperature envelope for electronic components. The desire to place engine control units on the engine and transmission control units either on or in the transmission will push the ambient temperature above 125/spl deg/C. However, extreme cost pressures,…
Miniaturization is the central theme in modern fabrication technology. Many of the components used in modern products are getting smaller and smaller. In this paper, the recent development of the electron beam lithography technique is reviewed with an emphasis on fabricating devices at the nanometer scale. Because of its very short wavelength and reasonable energy…
Pressure-assisted low-temperature sintering of silver paste is shown to be a viable alternative to solder reflow as a die-attachment solution. A quasihydrostatic pressure is used to lower the sintering temperature. The effect of parameters such as temperature and pressure are investigated. Characterization of the silver-attached samples shows a significant improvement in electrical conductivity, thermal conductivity…
Whisker publications from 1947 through 2004 are summarized and referenced in this document. The bibliography listings are chronological (by publication year) while the anthology section arranges references by topic. Almost all of the referenced documents deal with tin whiskers, but there are few that deal with zinc whiskers.
This paper describes a constant impedance transmission line pulse system with new measurement capabilities and improved accuracy. The paper enforces a broader look at transmission line pulse (TLP) data, beyond the I-V curves. Accurate TLP measurements and actual TLP/HBM device data are used to demonstrate dV/dt effects and HBM/TLP correlation and miscorrelation. Finally, a calibration…
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