Write in a clean editor, then format for IEEE Transactions on Components Packaging and Manufacturing Technology Part B in one click — DocuGuru applies the official IEEE template with numbered references and exports a submission-ready PDF plus the editable LaTeX source. Free to start.
IEEE Transactions on Components Packaging and Manufacturing Technology Part B is a peer-reviewed journal published by IEEE, covering Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Electromagnetic Compatibility and Noise Suppression.
| Publisher | IEEE |
|---|---|
| Reference style | Numbered (IEEE) Numbered — [1], [2] in the text [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Components Packaging and Manufacturing Technology Part B, vol. 12, no. 3, pp. 45–58, 2023.
Formats any DOI in IEEE Transactions on Components Packaging and Manufacturing Technology Part B style. No sign-up. |
| Publishes research in | Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Electromagnetic Compatibility and Noise Suppression Semiconductor Lasers and Optical Devices Low-power high-performance VLSI design |
| ISSN | 1070-9894 |
| h-index | 47 |
| i10-index | 235 |
| Total citations | 8,832 |
| Top institutions publishing here | Motorola (United States) |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
This paper reviews the state-of-the-art in three-dimensional (3-D) packaging technology for very large scale integration (VLSI). A number of bare dice and multichip module (MCM) stacking technologies are emerging to meet the ever increasing demands for low power consumption, low weight and compact portable systems. Vertical interconnect techniques are reviewed in detail. Technical issues such…
A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed. It is compatible with a SPICE-based modeling method for the rest of the power supply hierarchy and the devices. A modified SPICE is used to accommodate distributed circuits. The distributed circuits are built with microwave analysis software and…
This paper describes the interconnect and circuit modeling techniques to analyze the on-chip power supply noise for high-performance very large scale integration (VLSI) design. To reduce the complexity of full-chip analysis, a hierarchical power supply distribution model, which consists of a 12/spl times/12 package model, a 50/spl times/50 on-chip power bus model, and a distributed…
In this paper, the flow of encapsulant during the underfill encapsulation of flip-chips has been studied. Analytical as well as numerical methods have been developed to analyze the flow. For capillary-driven encapsulation (by dispensing), the capillary force at the melt-front has been calculated based on a model for the melt-front shape. A model has also…
A systematic experiment on flip-chip bonding assembly using an anisotropically conductive adhesive (ACA) has been carried out. The assembled modules have been characterized by a number of environmental tests, including aging, constant humidity, temperature cycling, humidity cycling, shear, vibration, and shock testing. The results indicate that under optimum process conditions, high quality and high reliability…
