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IEEE Transactions on Components Hybrids and Manufacturing Technology Template

Write in a clean editor, then format for IEEE Transactions on Components Hybrids and Manufacturing Technology in one click — DocuGuru applies the official IEEE template with numbered references and exports a submission-ready PDF plus the editable LaTeX source. Free to start.

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About the IEEE Transactions on Components Hybrids and Manufacturing Technology format

IEEE Transactions on Components Hybrids and Manufacturing Technology is a peer-reviewed journal published by IEEE, covering Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Electrical Contact Performance and Analysis.

PublisherIEEE
Reference styleNumbered (IEEE)
Numbered — [1], [2] in the text
[1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Components Hybrids and Manufacturing Technology, vol. 12, no. 3, pp. 45–58, 2023.

Formats any DOI in IEEE Transactions on Components Hybrids and Manufacturing Technology style. No sign-up.

Publishes research inElectronic Packaging and Soldering Technologies 3D IC and TSV technologies Electrical Contact Performance and Analysis Semiconductor materials and devices Adhesion, Friction, and Surface Interactions
ISSN0148-6411
h-index70
i10-index772
Total citations29,329
Top institutions publishing hereAT&T (United States)
Journal websiteieeexplore.ieee.org
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Papers published in IEEE Transactions on Components Hybrids and Manufacturing Technology per year

84
1983
67
1984
87
1985
82
1986
103
1987
178
1988
107
1989
169
1990
132
1991
147
1992
138
1993
1
2021

Citation impact of IEEE Transactions on Components Hybrids and Manufacturing Technology by publication year

1.6K
1983
1.5K
1984
1.4K
1985
1.4K
1986
2.1K
1987
1.7K
1988
2.3K
1989
3.3K
1990
2.1K
1991
4.1K
1992
2.9K
1993
127
2021

Citations each year’s papers have accumulated so far — the most recent years are still building up.

Most-cited papers in IEEE Transactions on Components Hybrids and Manufacturing Technology

S-parameter-based IC interconnect transmission line characterization

W.R. Eisenstadt, Y. Eo · 1 Jan 1992

A methodology for extracting high-frequency IC interconnect transmission parameters directly from S-parameter measurements has been demonstrated using on-chip test structures. The methodology consists of: (1) building on-chip interconnect structures for microwave test, (2) characterizing and subtracting measurement system parasitics, (3) extracting the transmission line impedance and propagation constant (attenuation constant and phase constant) from the…

628 citations Cite SaveGo to paper →
Constitutive relations for tin-based solder joints

Robert Darveaux, K. Banerji · 1 Jan 1992

Extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb2.5Sn, and 95Pb5Sn solder are presented. All of the data were collected on soldered assemblies to properly account for the effects of grain size and intermetallic compound distribution. Tensile and shear loading were employed in the strain rate range between 10/sup -8/ and 10/sup -1/ s/sup -1/ and the…

469 citations Cite SaveGo to paper →
Heat sink optimization with application to microchannels

Roy W. Knight, D. J. Hall, J. S. Goodling et al. · 1 Jan 1992

The equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow. A scheme presented for solving these equations permits the determination of heat sink dimensions that display the lowest thermal resistance between the hottest portion of the heat sink and…

411 citations Cite SaveGo to paper →
Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

W. Engelmaier · 1 Sep 1983

An ana1ytica1 method is described which provides estimates to first order of the number of either power or envirnnmenta1 cyc1es 1eading to so1der joint fai1ure. Vari0us parameter variations such as so1der joint height, ceramic chip carrier (CCC) size, printed c1rcuit substrate (PCS) materia1, etc. are investigated and discussed and samp1e estimates for a 0.65 x…

366 citations Cite SaveGo to paper →
Fatigue of 60/40 Solder

H. D. Solomon · 1 Dec 1986

Plastic strain versus fatigue life data are presented for tests run at -- 50, 35, 125, and 150°C. It was found that these data could be correlated by the Coffin-Manson fatigue law, with an exponent of approximately 0.5 for the tests run at -35°C to 125°C. At 150°C the exponent was reduced to 0.37. These…

300 citations Cite SaveGo to paper →

IEEE Transactions on Components Hybrids and Manufacturing Technology template — frequently asked questions

How do I write a paper in the IEEE Transactions on Components Hybrids and Manufacturing Technology format?
In DocuGuru you write your manuscript in a normal editor — no LaTeX setup required — and select the IEEE Transactions on Components Hybrids and Manufacturing Technology template. When you export, DocuGuru compiles the paper into the official IEEE format and hands you a submission-ready PDF along with the editable LaTeX source.
What reference style does IEEE Transactions on Components Hybrids and Manufacturing Technology use?
IEEE Transactions on Components Hybrids and Manufacturing Technology uses Numbered (IEEE) references, shown as numbered [1], [2] markers in the text. DocuGuru formats every in-text citation and the reference list in this exact style automatically. A reference appears like this: [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Components Hybrids and Manufacturing Technology, vol. 12, no. 3, pp. 45–58, 2023.
Do I need to know LaTeX to submit to IEEE Transactions on Components Hybrids and Manufacturing Technology?
No. DocuGuru generates the IEEEtran LaTeX class and compiles the PDF for you in the background, so you get a IEEE-ready IEEE Transactions on Components Hybrids and Manufacturing Technology document without writing any LaTeX. If you do want it, the LaTeX source is included in the export.
Can I import an existing draft into the IEEE Transactions on Components Hybrids and Manufacturing Technology template?
Yes. Paste or upload your current manuscript — Word, LaTeX, Markdown, or plain text — and DocuGuru reflows it into the IEEE Transactions on Components Hybrids and Manufacturing Technology format with correct headings, figures, tables, and numbered citations.
Who publishes IEEE Transactions on Components Hybrids and Manufacturing Technology?
IEEE Transactions on Components Hybrids and Manufacturing Technology is a engineering and computer science journal published by IEEE. DocuGuru's IEEE Transactions on Components Hybrids and Manufacturing Technology template matches IEEE's official submission format.
Can I export a submission-ready IEEE Transactions on Components Hybrids and Manufacturing Technology PDF?
Yes — DocuGuru produces a PDF built with the official IEEE Transactions on Components Hybrids and Manufacturing Technology template (the IEEEtran class) that is ready to submit to IEEE, together with the matching LaTeX source files.
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