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International Journal of Abrasive Technology is a peer-reviewed journal published by Inderscience, covering Advanced Surface Polishing Techniques, Advanced machining processes and optimization, Advanced Machining and Optimization Techniques.
| Publisher | Inderscience |
|---|---|
| Reference style | Author–year (Harvard/AGSM) Author–year — (Smith, 2023) in the text Smith, A., Jones, B. and Lee, C. (2023) 'A representative article title', International Journal of Abrasive Technology, 12(3), pp. 45–58.
Formats any DOI in International Journal of Abrasive Technology style. No sign-up. |
| Publishes research in | Advanced Surface Polishing Techniques Advanced machining processes and optimization Advanced Machining and Optimization Techniques Tunneling and Rock Mechanics Diamond and Carbon-based Materials Research |
| ISSN | 1752-2641 |
| Citation impact (2-yr) | 0.31 |
| h-index | 16 |
| i10-index | 45 |
| Total citations | 1,409 |
| Top institutions publishing here | Guangdong University of Technology |
| Journal website | www.inderscience.com |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
A heat transfer model for the precision grinding process on nano-zirconia ceramics has been investigated. Based on the analysis of the processing properties of nano-zirconia ceramic materials, a theoretical model for the temperature field in the grinding of nano-zirconia ceramics was established. The model was then simulated and analysed under different grinding conditions. The effect…
Modern aerospace and electronic industries make frequent use of the difficult to machine materials. The micro machining of these materials with conventional edged tool is uneconomical with poor quality of the surface. A relatively new micromachining technology based on magnetic assistance has been used in the recent past to produce quality surface finish on these…
In this research single point diamond turning (SPDT) is coupled with the micro-laser assisted machining (µ-LAM) technique to machine an unpolished single crystal silicon (100) wafer. SPDT of silicon (Si) can be an extremely abrasive process due to the hardness of this material. Manufacturing this material without causing surface and subsurface damage is extremely challenging…
An elliptical ultrasonic assisted grinding method is proposed for the machining of sapphire substrate in order to improve the machining efficiency and the work-surface quality. An elliptical ultrasonic vibrator is designed and produced by bonding a piezoelectric ceramic device (PZT) on a metal elastic body. The sapphire substrate is fixed onto the top face of…
Grinding process on the Si wafer develops subsurface damage, which remarkably degrades deflective strength of the wafer and constitutes a barrier against producing a thin wafer for low-profile packaging. In this paper, the authors propose a new index for evaluation of the Degree of Subsurface Damage (DSD). Requiring no costly instrument, the new index is…
