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IEEE Transactions on Components Packaging and Manufacturing Technology Part C is a peer-reviewed journal published by IEEE, covering Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Manufacturing Process and Optimization.
| Publisher | IEEE |
|---|---|
| Reference style | Numbered (IEEE) Numbered — [1], [2] in the text [1] A. Smith, B. Jones, and C. Lee, "A representative article title," IEEE Transactions on Components Packaging and Manufacturing Technology Part C, vol. 12, no. 3, pp. 45–58, 2023.
Formats any DOI in IEEE Transactions on Components Packaging and Manufacturing Technology Part C style. No sign-up. |
| Publishes research in | Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Manufacturing Process and Optimization Integrated Circuits and Semiconductor Failure Analysis Electrostatic Discharge in Electronics |
| ISSN | 1083-4400 |
| h-index | 27 |
| i10-index | 66 |
| Total citations | 2,582 |
| Top institutions publishing here | Georgia Institute of Technology |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
Epoxy underfill is often required to enhance the reliability of flip-chip interconnects. This study evaluates the flow of typical epoxy underfill materials between parallel plates driven by capillary action. An exact model was developed to understand the functional relationship between flow distance, flow time, separation distance, surface tension, and viscosity for quasisteady laminar flow between…
Electrically conductive adhesives offer a lead free, relatively low temperature process for attachment of surface mount components to printed circuit boards (PCB's). The National Center for Manufacturing Sciences (NCMS) Conductive Adhesives project has defined a requirement for an isotropically conductive adhesive (ICA). In this study, 25 commercially available silver-filled epoxies were evaluated for joint resistance…
Transmission line pulsing (TLP) is well-established for the IV-characterization of electrostatic discharge (ESD)-protection elements. There still is a significant gap between the performance of present TLP-systems and the demands of the charged device model (CDM). A very fast, narrow-pulse (>3.5 ns), high-current TLP (VF-TLP) is designed to reduce this gap. It is feasible to study…
As operation frequencies and performance requirements of wireless devices increase, the resultant demands on the performance of passive components also increase. Miniaturization of inductive components for high frequency has been a key research area to address this issue; however, in general, miniaturized integrated inductors can suffer from low Q factors and/or self-resonant frequencies when compared…
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