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Power Electronic Devices and Components is a peer-reviewed journal published by Elsevier, covering Silicon Carbide Semiconductor Technologies, GaN-based semiconductor devices and materials, Semiconductor materials and devices.
| Publisher | Elsevier |
|---|---|
| Reference style | Numbered (Elsevier) Numbered — [1], [2] in the text [1] A. Smith, B. Jones, C. Lee, A representative article title, Power Electronic Devices and Components 12 (2023) 45–58.
Formats any DOI in Power Electronic Devices and Components style. No sign-up. |
| Publishes research in | Silicon Carbide Semiconductor Technologies GaN-based semiconductor devices and materials Semiconductor materials and devices Electromagnetic Compatibility and Noise Suppression Multilevel Inverters and Converters |
| ISSN | 2772-3704 |
| Citation impact (2-yr) | 1.73 |
| h-index | 12 |
| i10-index | 17 |
| Total citations | 630 |
| Article processing charge | $1,500 |
| Open access | Yes |
| Top institutions publishing here | Centre National de la Recherche Scientifique |
| Journal website | www.journals.elsevier.com |
| You get | A submission-ready PDF and the editable LaTeX source — ready to submit. |
Citations each year’s papers have accumulated so far — the most recent years are still building up.
Today, the Internal Combustion Engine (ICE) is gradually being replaced by electric motors, which results in higher efficiency and low emission of greenhouse gases. The electric vehicle either works wholly or partially on electrical energy generated from batteries and ultra-capacitors. The battery or ultra-capacitor is either charged from the AC supply connected to a grid…
Embedding power semiconductor devices into printed circuit boards (PCB) provides several benefits compared to conventional packaging technologies. Integrating the semiconductor dies into the circuit board reduces the converter size. This results in short current loops, enabling low interconnection resistances and parasitic inductances. Both contribute to a higher system-level efficiency, as conduction and switching losses are…
The techniques of extended finite element method, level set method and the submodelling approach are implemented in this study to model crack and crack growth in ultrasonically bonded thick aluminium wire for the IGBT power electronics modules under different loading conditions for the purpose of lifetime prediction and reliability assessment during design and manufacturing stages.…
Real-time temperature monitoring of power semiconductors is a powerful tool for the predictive maintenance and lifetime prediction of power converters, and is typically performed by measuring temperature sensitive electrical parameters (TSEP). In this work, we demonstrate a machine learning based method to estimate the on-state voltage of a real converter prototype featuring variable load of…
Base metal electrode (BME) multilayer ceramic capacitors (MLCCs) are widely used in aerospace, medical, military, and communication applications, emphasizing the need for high reliability. The ongoing advancements in BaTiO3-based MLCC technology have facilitated further miniaturization and improved capacitive volumetric density for both low and high voltage devices. However, concerns persist regarding infant mortality failures and…
